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Alumnus Receives Best Paper Award from the International Conference on Computer Science and Applications

The Ohio State University alumnus William Simpson (MS AE ’73, PhD AE ’78) received the 2017 Best Paper Award from the International Conference on Computer Science and Applications 2017, for his paper entitled “Enterprise Level Security: Insider Threat Counter-Claims”.

SimpsonSimpsonHosted by the International Association of Engineers, a non-profit international association for the engineers and the computer scientists, Simpson’s Best Paper Award was recognized at the group’s World Congress on Engineering & Computer Science, held in San Francisco, October 25-27, 2017.

Simpson was supported in his research by the Institute for Defense Analysis, a nonprofit corporation that operates three federally-funded research and development centers in the public interest.

In addition to serving as a senior member of the Institute of Electrical and Electronic Engineers, Simpson is the program committee officer of the International Association of Engineers and an editorial staff member of the Academy & Industrial Research Collaboration Center.